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AA-DUCT 771 High-Performance Conductive Silver Epoxy 2µm Max Particle Size, 2 Part Room Temp Cure

AA-DUCT 771 High-Performance Conductive Silver Epoxy 2µm Max Particle Size, 2 Part Room Temp Cure

AA-DUCT 771 High-Performance Conductive Silver Epoxy 2µm Max Particle Size, 2 Part Room Temp Cure

AA-DUCT 771-2X40

AA-DUCT 771 is a two-component, room-temperature curing, silver-filled conductive epoxy formulated for precise applications requiring ultra-fine particle sizes of 2 microns or smaller.

This high-performance epoxy offers versatile curing options, curing at room temperature or with heat acceleration, making it ideal for applications that demand the smallest possible conductive particles.

AA-DUCT 771 delivers outstanding mechanical, electrical, and physical performance, maintaining reliability at temperatures up to 180°C.

It is a smooth, soft paste that can be applied by hand, automatic dispensers, screen-printing, transfer, or stamping techniques, forming a complete percolation network within 20-micron holes.

Color    Silver
Cure Type    Room Temperature or Heat Cure
Benefits    
High strength
Perfect bond
Cold solder for heat-sensitive components
Mix Ratio by Weight    100:4 Resin to Hardener
Substrates    Metal, Glass, Aluminum, Steel, Bronze, Nickel, Wood, Ceramic, and more
Operating Temperature    -40°C (-40°F) to +180°C (356°F)
Typical Applications    Die attach, circuitry, printed circuit board, and electronics repair
UNCURED PROPERTIES
Viscosity @ 25°C, cps    100,000 ±10,000
Specific Gravity, Mixed    3.40
Reactive Solids Contents, %    100
Pot Life    30 minutes
Shelf Life    6 months (plastic pouch), 1 year (jar kit)

CURE SCHEDULE
24 Hours    25°C (77°F)
90 Minutes    60°C (140°F)
45 Minutes    80°C (176°F)
15 Minutes    120°C (212°F)
CURED PROPERTIES
Hardness, Shore D    80
Volume Resistivity, ohm·cm    0.002
Lap Shear Strength to Aluminum, PSI    1800
THERMAL PROPERTIES
Thermal Conductivity, W/mK    2.2
Operating Temperature Range    -40°C (-40°F) to +180°C (356°F)
GENERAL INFORMATION
For safe handling information on this product, consult the Safety Data Sheet (SDS).

HOW TO USE
Carefully clean and dry all surfaces to be bonded.
Apply AA-DUCT 771 completely mixed epoxy to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
Some ingredients in this formulation may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C (125°F) for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AA-DUCT 771-2X40

Select size
From $452.40

Original: $1,508.00

-70%
AA-DUCT 771 High-Performance Conductive Silver Epoxy 2µm Max Particle Size, 2 Part Room Temp Cure

$1,508.00

$452.40

Description

AA-DUCT 771 High-Performance Conductive Silver Epoxy 2µm Max Particle Size, 2 Part Room Temp Cure

AA-DUCT 771-2X40

AA-DUCT 771 is a two-component, room-temperature curing, silver-filled conductive epoxy formulated for precise applications requiring ultra-fine particle sizes of 2 microns or smaller.

This high-performance epoxy offers versatile curing options, curing at room temperature or with heat acceleration, making it ideal for applications that demand the smallest possible conductive particles.

AA-DUCT 771 delivers outstanding mechanical, electrical, and physical performance, maintaining reliability at temperatures up to 180°C.

It is a smooth, soft paste that can be applied by hand, automatic dispensers, screen-printing, transfer, or stamping techniques, forming a complete percolation network within 20-micron holes.

Color    Silver
Cure Type    Room Temperature or Heat Cure
Benefits    
High strength
Perfect bond
Cold solder for heat-sensitive components
Mix Ratio by Weight    100:4 Resin to Hardener
Substrates    Metal, Glass, Aluminum, Steel, Bronze, Nickel, Wood, Ceramic, and more
Operating Temperature    -40°C (-40°F) to +180°C (356°F)
Typical Applications    Die attach, circuitry, printed circuit board, and electronics repair
UNCURED PROPERTIES
Viscosity @ 25°C, cps    100,000 ±10,000
Specific Gravity, Mixed    3.40
Reactive Solids Contents, %    100
Pot Life    30 minutes
Shelf Life    6 months (plastic pouch), 1 year (jar kit)

CURE SCHEDULE
24 Hours    25°C (77°F)
90 Minutes    60°C (140°F)
45 Minutes    80°C (176°F)
15 Minutes    120°C (212°F)
CURED PROPERTIES
Hardness, Shore D    80
Volume Resistivity, ohm·cm    0.002
Lap Shear Strength to Aluminum, PSI    1800
THERMAL PROPERTIES
Thermal Conductivity, W/mK    2.2
Operating Temperature Range    -40°C (-40°F) to +180°C (356°F)
GENERAL INFORMATION
For safe handling information on this product, consult the Safety Data Sheet (SDS).

HOW TO USE
Carefully clean and dry all surfaces to be bonded.
Apply AA-DUCT 771 completely mixed epoxy to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
Some ingredients in this formulation may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C (125°F) for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AA-DUCT 771-2X40

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AA-DUCT 771 High-Performance Conductive Silver Epoxy 2µm Max Particle Size, 2 Part Room Temp Cure | ADVANCED SOLUTIONS DISPLAY